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Magazine Name : Ieee Transactions On Electronics Packaging Manufacturing

Year : 2003 Volume number : 26 Issue: 04

Electrical Test Strategies For A Wafer-Level Packaging Technology (Article)
Subject: Interconnections , Packaging , Testing , Wafer Level Package
Author: David C. Keezer      Chirag S. Patel      Muhannad S. Bakir      Qing Zhou     
page:      267 - 272
Comparative Study Of Fluid Dispensing Modeling (Article)
Subject: Computational Fluid Dynamics , Dispenser , Flow Rates , Nonnewtonian Viscosity
Author: Yi-Ping Hong      Han-Xiong Li     
page:      273 - 280
Design And Fabrication Of An Ic Encapsulation Mold Adhesion Force Tester (Article)
Subject: Adhesion Force , Emc , Ic Packaging , Fabrication
Author: Shyang-Jye Chang      Sheng-Jye Hwang     
page:      281 - 285
Off-Line Control Of Time-Pressure Dispensing Processes For Electronics Packaging (Article)
Subject: Electronic Packaging , Model Updating , Off-Line Control , Time-Dependent Fluid Behavior
Author: X. B Chen      W.J. Zhang      G. Schoenau      B. Surgenor     
page:      286 - 293
Partial Discharge Testing Of Solder Fillets Onpcbs In A Partial Vacuum: New Experimental Results (Article)
Subject: Partial Discharges , Printed Circuit Board , High Voltage Systems , Solder Fillets
Author: Lorenzo Capineri      Gabriele Dainelli      Maurizio Materassi      Barrie D. Dunn     
page:      294 - 304
Evaluation Of Selected Japanese Lead-Free Consumer Electronics (Article)
Subject: Circuit Cards , Eds , "Green" Labels , Icp-Aes
Author: Yuki Fukuda      Michael Pecht      Paul Casey     
page:      305 - 312
Processing And Reliability Of Csps With Underfill (Article)
Subject: Chip Scale Package , Drop Test , Underfill , Processing
Author: Jing Liu      R. Wayne Johnson      Erin Yaeger      Larry Crane     
page:      313 - 319
An Investigation Of Bulk Recycling Planning For An Electronics Recycling Facility Receiving Industrial Returns Versus Residential Returns (Article)
Subject: Bulk Recyclilng , Electronics Product Take-Back , Industrial Returns , Production Planning
Author: Ann Stuart      Qin Lu     
page:      320 - 327
New Quality Cost Models To Optimize Inspection Strategies (Article)
Subject: Assemblies , Mathematical Models , Spc , Defect Rates
Author: Martin Oppermann      Wilfried Sauer      Heinz Wohlrabe      Thomas Zerna     
page:      328 - 337
Genetic Algorithms Applied To Optimal Tolerance Levels Of Multiattribute Inspection Errors (Article)
Subject: Genetic Algorithm , Coo , Multiattributes Inspection , Optimal Error Levels
Author: So Young Sohn      Yuoung Uk Moon     
page:      338 - 344
Surface Property Of Passivation Layer On Integrated Circuit Chip And Solder Mask Layer On Printed Circuit Board (Article)
Subject: Contact Angle , Passivation , Surface Tension , Surface Treatment
Author: Shijian Luo      C. P. Wong     
page:      345 - 351